Menu
Pad-refreshing consumable for removal of polyurethane pad surface clogging
Semiconductor Chip-Maker (Non-memory, Memory (DRAM/FLASH), Foundries)
4.25″ (Stainless Steel, Diamond-Nickel Bonding)
Semiconductor CMP process (Buffing, Barrier, Poly, SOH)
6804.21-0000
Stable Pad Roughness, Long pad life time, Small debris size & Amount
61, Sinwon-ro 91beon-gil, Danwon-gu, Ansan-si, Gyeonggi-do, Korea
info@saesoldiamond.com
031.493.5037
503-645-2009
© 2020. SAESOL DIAMOND. All rights reserved.
