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A diamond tool used in the wire-sawing step as part of the semiconductor wafering process; The main function is for slicing sapphire and silicon ingot.
Ingot growth and wafer manufacturers
230~250μm (Diamond-Nickel Bonding)
Ingot Slicing
8209.99-9000
Minimizing diamond clusters deposited on wires and optimizing the degree of uniformity High reuse rates compared to the competition
61, Sinwon-ro 91beon-gil, Danwon-gu, Ansan-si, Gyeonggi-do, Korea
info@saesoldiamond.com
031.493.5037
503-645-2009
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