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Pad-refreshing consumable for removal of polyurethane pad surface clogging
Semiconductor Chip-Maker (Non-memory, Memory (DRAM/FLASH), Foundries)
DS&HIVE
4.25″ (Stainless Steel, Diamond-Nickel Bonding)
Semiconductor CMP process (ILD, STI, Metal, Buffing, Barrier, Poly, Gate)
6804.21-0000
Stable Pad Roughness, Long conditioner life time, Long pad life time, Small debris size & Amount
61, Sinwon-ro 91beon-gil, Danwon-gu, Ansan-si, Gyeonggi-do, Korea
info@saesoldiamond.com
031.493.5037
503-645-2009
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