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Display glass, sapphire·and silicon wafer grinding device
Display glass, sapphire and silicon wafer edge processing
Φ50, Φ150, Φ175, Φ202 (Aluminum, Diamond-Metal Bonding)
glass, sapphire·silicon wafer edge grinding
6804.21-0000
No chipping in edge processing; outstanding cutting performance and quality
61, Sinwon-ro 91beon-gil, Danwon-gu, Ansan-si, Gyeonggi-do, Korea
info@saesoldiamond.com
031.493.5037
503-645-2009
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