PLATE
Pad-refreshing consumable for removal of polyurethane pad surface clogging
Target
Semiconductor Chip-Maker (Non-memory, Memory (DRAM/FLASH), Foundries)
Product Name
Standard
4.25″ (Stainless Steel, Diamond-Nickel Bonding)
Application
Semiconductor CMP process (ILD, STI, Metal)
No.
6804.21-0000
Features
Stable Pad Roughness, Long conditioner life time