A tool mounted on a grinder to make silicon/sapphire wafers and ceramics become thinner and flat
Grinder owners (customized production for different types of grinders)
Size – 8″ & 12″, Mesh – #10,000 ~ #30,000
silicon back grinding & ceramics processing, etc.
6804.21-0000
Porous vitrified bonds are applied for outstanding cutting performance and stable quality characteristics